A guide to the individual processes, equipment, and materials of semiconductor manufacturing technologies. It features chapters on silicon materials, SOI materials and devices, surface preparation, ion implantation, dopant diffusion, in-line metrology, yield modeling, photomask fabrication, failure analysis, and damascene copper electroplating.
The second edition of this standard-setting handbook provides an up-to-date reference to the individual processes, equipment, and materials of semiconductor manufacturing technologies. Edited by renowned experts, this book provides graphs, tables, and formulas for easy access to information as well as extensive references for further study. This edition features new and updated chapters on silicon materials, SOI materials and devices, surface preparation, ion implantation, dopant diffusion, in-line metrology, yield modeling, photomask fabrication, failure analysis, damascene copper electroplating, rapid thermal processing, interlevel dielectrics, plasma etch, atomic layer deposition, and more.
